# Thermal analysis

This system enables the user to compute the thermal filed for problems with steady heat transfer analysis (heat conduction) and problem with transient heat transfer analysis with all types of boundary conditions for the structures with arbitrary geometry. It is also possible to convert computed thermal fields into the thermal load in order to determine the stress-strain state of the structure.

## Simulation of heat conductivity

Steady and transient heat transfer process are simulated in the VISOR-SAPR environment.

On the Thermal Analysis tab it is possible to generate the FE model, edit, define thermophysical parameters to finite elements of heat conductivity (thermal conductivity coefficient, heat absorption coefficient, unit weight) and convection (coefficient of convective heat transfer), define boundary conditions, define standard and non-standard types of loads, carry out analysis, evaluate and prepare documentation with the output data for thermal analysis. The Thermal Analysis tab becomes available when you generate the problem with model type 15. Thermal Analysis tab – to generate, modify, analyse and evaluate problems with heat conductivity

### Finite elements of heat conductivity and convection

Unidimensional, 2D and 3D finite elements of heat transfer are used for problems with heat conductivity. To simulate the contact between the surface and environment, there are special finite elements of convective heat transfer. Finite elements applied to carry out thermal analysis

All finite elements of heat conductivity were verified for the convergence of the solution with analytical methods.

To simulate different types of thermal load, the following data may be applied: specified temperature at node, heat flow at the body surface, specified exterior temperature for the elements of convection, non-standard types of loads and radiant heat transfer (radiation). Load on node (transient heat transfer analysis)

How to carry out transient heat transfer analysis

### Heat flow in nodes of design model

It is possible to compute the heat flow in problems of heat conductivity and to sum up the heat flow for the selected load cases.

### Generation of thermal loads by results of thermal analysis

To create thermal loads to compute the stress-strain state of the structure, it is possible to use the following results:

• in problem with steady heat transfer – computed thermal fields in any load case;
• in problem with transient heat transfer – analysis results at any time.

#### Generation of thermal loads on elements of design model according to computed temperatures

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### Preview, evaluation of analysis results, documentation

The output data of heat transfer analysis may be presented in tabular and graphical form: as mosaic plots and contour plots for temperature, mosaic plots of heat flow. The input data as well as output data may be documented with the help of Report Book. Input & output data is displayed in graphical and tabular formats

In this system the user could simulate different types of heat transfer (heat conductivity, convective-radiant heat transfer). It will be helpful when you solve the problems like thermal analysis of the building envelope, design effective fire protection for building structures, determine real fire resistance limit, etc.